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Valmisteilla (updated on 19/05/2022)
Viite: 
REX/544-EESC-2022
Täysistunto: 
571 -
Jul 13, 2022 Jul 14, 2022

Since the deep freeze of the TTIP negotiations, the Transatlantic partners – the EU and the US – are starting new ways of co-operation under the so called Trade and Technology Council (TTC), which was launched at the EU-US summit in Brussels on 15 June 2021. ...

Tiedote: The new EU-US Trade and Technology Council in action: priorities for business, workers and consumers and necessary safeguards

Valmisteilla (updated on 19/05/2022)
Viite: 
REX/547-EESC-2022
Täysistunto: 
569 -
May 18, 2022 May 19, 2022

COVID-19 has shown how interconnected the world is. As part of global recovery, the EU wants to redesign how we connect the world to build forward better. The European model is about investing in both hard and soft infrastructure, in sustainable investments in digital, climate and energy, transport, health, education and research, as well as in an enabling environment guaranteeing a level-playing field.

Valmisteilla (updated on 19/05/2022)
Viite: 
CCMI/195-EESC-2022

Semiconductor chips are the essential building blocks of digital and digitised products. From smartphones and cars, through critical applications and infrastructures for healthcare, energy, mobility, communications and industrial automation, chips are central to the modern digital economy. They determine performance characteristics of digital systems, among them security and energy-efficiency – essential to the EU’s digital and green transitions. They are also crucial to key digital technologies of the future, including artificial intelligence (AI), 5G and edge computing, as set out in the EU’s 2030 Digital Decade.  Put simply, there is no “digital” without chips.

ETSK:n jaoston lausunto: Implications of the European Chips Act for defence and aerospace manufacturing

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